Welcome to ICMPA 2024

The 2nd International Conference on Materials Physics and Applications (ICMPA 2024) will be held in Xi’an, China during October 1-3, 2024. The conference has the objective of creating an international forum for academics, researchers and scientists from worldwide to discuss worldwide results and proposals regarding to the soundest issues related to materials physics and applications. This event will include the participation of renowned plenary speakers, oral presentations, posters sessions and technical conferences related to the topics dealt with in the program as well as an attractive social and cultural program.

ICMPA 2024 welcomes researchers, engineers, scientists, and industry professionals to an open forum where advances in the field of new materials and applications can be shared and discussed.

For each accepted paper, at least one of the authors needs to register for the conference and present the paper virtually or physically. This is mandatory for including the paper in the proceedings. If participants with accepted papers are not able to present their work due to travel restriction during the conference period, they can attend virtually.

Publication & Indexing

After a careful reviewing process, all accepted papers after proper registration and presentation, will be published in the ICMPA 2024 Conference Proceeding. The proceedings will be submitted to Engineering Village, Scopus, Web of Science and other databases for reviewing and indexing.

Conference Topics

ICMPA 2024 is scheduled to include high-quality paper presentation sessions revealing the latest research findings, and to engage participants in interesting discussion sessions. Topics of interest for submission include, but are not limited to:

1. Nano Materials and Thin Film Technology	纳米材料与薄膜技术
2. Phase Transition and Mechanical Properties of Materials	材料的相变与力学性能
3. Thermodynamics of Materials	材料热力学
4. Material Modeling and Application	材料建模与应用
5. Materials Testing and Characterization	材料测试与表征
6. Semiconductor & Dielectric Material	半导体和介电材料
7. Plasma Physics, Photonic materials & Plasmonics	等离子体物理、光子材料和等离子体
8. Electronic Structure & Phonons	电子结构和声子
9. Superconductivity, Magnetism & Spintronics	超导、磁学和自旋电子学
10. Glasses & Ceramics, Composites Materials	玻璃与陶瓷、复合材料
11. Fuel cell materials	燃料电池材料
12. Hydrogen storage materials	储氢材料
13. Solar cell materials	太阳能电池材料
14. Nuclear Power Materials	核电材料
15. Lithium battery materials	锂电池材料
16. New Functional Materials	新型功能材料

Peer review procedures

1.Submission: The authors should submit their paper via online submission system.

2.Pre-review: We will check from the following aspects, research scope, plagiarism check and authors information.

3.1st round of Review: The paper will be assigned to at least 2 reviewers for peer review. It may take 2-3 weeks based on the reviewers’ schedule. The review report cannot be adopted with direct “accept”. There should be detailed and constructive suggestions, mostly based on the Language, Novelty, Methodology and Statement.

4.Revision: We will send the review comments to the corresponding author for 1st round revision. The author is required to revise the paper with change tracks and upload the revised paper together with response letters.

5.2nd Round of Review: The reviewers will review the revised paper and response letter, and give their review comments for “further revision” or “accept”. This step decides whether the paper can be accepted or need further revision.

6.Final Plagiarism Check: In case the paper maybe fully or partially published to elsewhere after acceptance. Although we have done this in pre-review, we will have a final check so that the proceedings is well prepared for publication.